FoodPackLab promotes the collaboration between international clusters and companies working in the food, packaging and photonics sectors in order to identify and develop solutions to challenges arising during the food processing and packaging stage that limit the food shelf life before being thrown out. Check out the involved network partners here, specified by their organisation type, domain and technologies.
Technology:
Domain: Food Processing, Food Packaging
Spain
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics
Spain
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics
Spain
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Technology: Sensors, Lasers, Advanced Lighting
Domain: Photonics
France
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Technology:
Domain: Food Processing, Food Packaging
Denmark
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Processing
Italy
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Technology:
Domain: Food Processing, Food Packaging
France
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Technology: Sensors, Advanced Lighting
Domain: Photonics, Food Processing
France
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Processing, Food Packaging
France
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Technology: Sensors, Advanced Lighting
Domain: Photonics
Germany
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Processing, Food Packaging
Germany
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Packaging
Spain
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Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Packaging
Spain
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